Bambu Lab PC Filament on Spool
Description
Bambu Lab's PC filament offers exceptional thermal resistance, ensuring reliable performance in high-temperature environments. With excellent mechanical properties, this filament provides strength, stability and durability for various applications.
Printing Tips
- Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.
- Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed. For more details please refer to: Filament drying cover on Bambu Lab Wiki.
- Bambu PC comes with a high-temperature resistant spool, which is not prone to deformation in the drying process. Continuing our concept of reducing plastic waste, the spool can also be reused with other Bambu refills.
- All printing parameters are embedded in RFID, which can be read through Bambu Lab AMS (Automatic Material System). Load and print! No more tedious setting steps.
Model Overview
| Recommended Printing Settings | |
|---|---|
| Drying Settings (Blast Drying Oven) | 80 ℃, 8h |
| Printing and Keeping, Container's Humidity | <20% RH (Sealed, with Desiccant) |
| Nozzle Temperature | 260 - 280 ℃ |
| Bed Temperature (with Glue) | 90 - 110 ℃ |
| Printing Speed | < 300 mm/s |
| Physical Properties | |
|---|---|
| Density | 1.20 g/cm³ |
| Vicat Softening Temperature | 119 ℃ |
| Heat Deflection Temperature | 117 ℃ |
| Melting Temperature | 228 ℃ |
| Melt Index | 32.2 ± 2.9 g/10 min |
| Mechanical Properties | |
| Tensile Strength | 55 ± 4 MPa |
| Breaking Elongation Rate | 3.8 ± 0.3 % |
| Bending Modulus | 2310 ± 70 MPa |
| Bending Strength | 108 ± 4 MPa |
| Impact Strength | 34.8 ± 2.1 kJ/m² |
Package Contents
- Filament x 1 & Desiccant x 1
- Instructions x 1 & Spool Sticker x 1
- Package x 1
- Filament Label x 1
